| PART |
Description |
Maker |
| 0-0519035-4 0-0519115-4 0-0519152-6 0-0519037-4 4- |
DIE SET IPT-VW WIRE CRIMP 25 SQMM
|
TE Connectivity Ltd
|
| 408-8737 |
The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw
|
Tyco Electronics
|
| TLE5009A16 |
Available as single die and dual die with separate supplies for each die
|
Infineon Technologies A...
|
| HYB18L2561 HYE25L256160AC-7.5 HYE25L256160AF-7.5 H |
HEX DIE SET,.052/.068/.100/.21
RT ANG PCB CONT .40/1.295 BULK
BJAWBMSpecialty DRAMs Mobile-RAM BJAWBMSpecialty DRAM的移动RAM
|
http://
INFINEON[Infineon Technologies AG]
|
| IRG4CC50WB |
IGBT Die in Wafer Form 600 V Size 5 WARP Speed
IRG4CC50WB IGBT Die in Wafer Form
|
Hittite Microwave Corporation
International Rectifier
|
| IRF7805PBF IRF7805PBF-15 |
N Channel Application Specific MOSFETs
HEXFET㈢ Chip-Set for DC-DC Converters
HEXFET? Chip-Set for DC-DC Converters
|
International Rectifier
|
| MC74HC109 ON1335 |
Dual J-K Flip-Flop with Set and Rest
From old datasheet system
DUAL J-K FLIP-FLOP WITH SET AND RESET
|
Motorola, Inc
ON Semi
|
| K4H560838E-TC/LB0 K4H560838E-TC/LA2 K4H560838E-TC/ |
DDR SDRAM 256Mb E-die (x4, x8) 256Mb的DDR SDRAM的电子芯片（了x4，x8
Quad Wide Bandwidth High Output Drive Single Supply Op Amp 16-PDIP -40 to 125
256Mb E-die DDR SDRAM Specification 66 TSOP-II
Dual Micropower Precision Low-Voltage Operational Amplifier 8-SOIC -55 to 125
10-Bit, 32 kSPS ADC Serial Out, uProcessor Periph./Standalone, 11 Ch. 20-PLCC
10-Bit, 32 kSPS ADC Serial Out, uProcessor Periph./Standalone, 11 Ch. 20-PDIP
DDR SDRAM 256Mb E-die (x4, x8)
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| MR18R162GAF0 MR16R162GAF0 MR18R1624AF0 MR18R1622AF |
64M X 16 RAMBUS MODULE, DMA184
TVS 500W 6.5V BIDIRECT DO-15 6Mx16显示）2/8/16）件RIMM的模块，基于256Mb阿芯片，32秒银行，16K/32ms参考，.5V
16Mx16显示）2/8/16）件RIMM的模块，基于256Mb阿芯片，32秒银行，16K/32ms参考，.5V
(MR18R1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
(MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
|
| BCM7328 |
Single-Chip Satellite Set-Top Dual TV Decoder with Integrated 8PSK
SINGLE-CHIP SATELLITE SET-TOP BOX DECODER
|
BOARDCOM[Broadcom Corporation.]
|
| IRLC1304 2299 |
HEXFET Power MOSFET Die in Wafer Form(晶圆形式的HEXFET 功率MOS场效应管)
From old datasheet system
HEXFET? Power MOSFET Die in Wafer Form
|
International Rectifier
|
| MS125 MS80 MS250 MS380 MS40 MS500 |
Surface Mount Si-Bridge-Rectifiers Si-Br?kengleichrichter f? die Oberfl?henmontage
Surface Mount Si-Bridge-Rectifiers Si-Br?kengleichrichter f? die Oberfl溷henmontage
|
DIOTEC[Diotec Semiconductor]
|
